Loop type micro heat transport device

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

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Details

C165S104330, C361S700000

Reexamination Certificate

active

07971633

ABSTRACT:
Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.

REFERENCES:
patent: 4602679 (1986-07-01), Edelstein et al.
patent: 4611474 (1986-09-01), Musinski
patent: 5179043 (1993-01-01), Weichold et al.
patent: 6679318 (2004-01-01), Bakke
patent: 6889756 (2005-05-01), Hou
patent: 6976527 (2005-12-01), Kirshberg et al.
patent: 6999314 (2006-02-01), Tonosaki et al.
patent: 2003/0066625 (2003-04-01), Kirshberg et al.
patent: 2004/0052057 (2004-03-01), Ohmi et al.
patent: 2004/0069460 (2004-04-01), Sasaki et al.
patent: 2004-044990 (2004-02-01), None
patent: 2004-077051 (2004-03-01), None
patent: 2004-108760 (2004-04-01), None
patent: 2004-190985 (2004-07-01), None
patent: 1020040017211 (2004-02-01), None
patent: 1020040032471 (2004-04-01), None
patent: 10-2004-0103151 (2004-12-01), None
“Cooling Effect of a MEMS Based Micro Capillary Pumped Loop for Chip-Level Temperature Control”, by Jeffrey Kirshberg et al., ASME 2000.
:Steady-State Modeling and Testing of a Micro Heat Pipe, B. R. Babin et al., Journal of Heat Transfer, Aug. 1990, vol. 112/595-601.

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