Loop thermosyphon with wicking structure and semiconductor...

Details Loop thermosyphon with wicking structure and semiconductor... Loop thermosyphon with wicking structure and semiconductor...

2006-10-10

2006-10-10

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S700000, C361S704000, C361S699000, C165S080300, C165S080400, C165S104330, C062S259200

Reexamination Certificate

active

07120022

ABSTRACT:
A loop thermosyphon system has a semiconductor die with a plurality of microchannels. A condenser is in fluid communication with the microchannels. A wicking structure wicks fluid between the condenser to the semiconductor die.

REFERENCES:
patent: 6501654 (2002-12-01), O'Connor et al.
patent: 6976527 (2005-12-01), Kirshberg et al.
patent: 2002/0179284 (2002-12-01), Joshi et al.

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