Loop heat pipe modularized heat exchanger

Details Loop heat pipe modularized heat exchanger Loop heat pipe modularized heat exchanger

2002-06-19

2004-02-10

McKinnon, Terrell (Department: 3743)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S185000, C165S104210, C165S104330, C361S700000, C174S015200, C257S715000

Reexamination Certificate

active

06688377

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat exchanger system, particularly to a loop heat pipe modularized heat exchanger system.
2. Description of Related Art
A conventional CPU-mounted heat exchanger, as shown in
FIG. 1
, comprises an attach block
10
′, a heat pipe
11
′, a heat exchanging unit
12
′, and a fan
13
′. The attach block
10
′ is mounted on a CPU
20
′. The heat pipe
11
′ connects with the attach block
10
′ and the heat exchanging unit
12
′ respectively. The fan
13
′ is disposed by the heat exchanging unit
12
′ to supply air for dissipating heat from the heat exchanging unit. As shown in
FIG. 2
, the heat pipe
11
′ is filled with a wick layer
111
′ so that fluid which evaporates easily flows inside the heat pipe
11
′ along the wick layer
111
′. The heat pipe
11
′ has a heated end connected to the attach block
10
′ and a cooled end connected to a lower side of the heat exchanging unit
12
′. The attach block
10
′ conducts heat generated by the CPU
20
′ and cause fluid in the heat pipe
11
′ to evaporate as vapor so that the vapor can absorb the heat and cool the CPU
20
′. At the cooled end of the heat pipe
11
′, the vapor condensates and returns to the heated end
112
′ to be heated and evaporated again, performing a heat-exchange cycle. Liquid and vapor in the heat pipe
11
′ flow counter to each other in a single pipe and pressure loss is large. If the heat pipe
11
′ is long, the efficiency of heat exchange is worse. There is no way tightly to engage the cooling end to a base or fins of the heat exchange unit
12
′ so that it results in a relatively large thermal resistance. The contact area between the heated end and the attach block is limited and it is not possible to eliminate a generated clearance between the heated end and the attach block so that the efficiency of heat transfer is low. If the attach block
10
′ is thicker, it will result in a larger thermal resistance to affect the efficiency of heat dissipation. Conventional heat exchangers not only have the shortcomings mentioned above but are also expensive to manufacture due to a large number of single components.
SUMMARY OF THE INVENTION
It is the main object of the present invention to provide a loop heat pipe modularized heat exchanger system with good efficiency of heat transfer.
Another object of the present invention is to provide a loop heat pipe modularized heat exchanger system with less component parts and easy assembly and manufacture.


REFERENCES:
patent: 5329993 (1994-07-01), Ettehadieh
patent: 5947193 (1999-09-01), Adkins et al.
patent: 6005772 (1999-12-01), Terao et al.
patent: 6076596 (2000-06-01), Osakabe et al.
patent: 6082443 (2000-07-01), Yamamoto et al.
patent: 6321831 (2001-11-01), Tanaka et al.

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