Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent
1997-03-28
1999-08-03
Heinrich, Samuel M.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
228 54, H05K 1306
Patent
active
059313684
ABSTRACT:
The present invention relates to post manufacturing operations for improving the working life of known bonding tools such as capillaries, wedges and single point TAB tools of the type used in the semiconductor industry to make fine wire or TAB finger interconnections. After the desired bonding tool is manufactured to predetermined specifications, dimensions and tolerances, it is placed in a sputtering chamber with hard target material with an ionizing gas. A controlled volume of sputtered hard material is generated at high temperature by plasma ion bombardment and deposited onto the working face of the bonding tool while the tool is held at a temperature that prevents distortion. A very thin amorphous hard layer is bonded onto the working face of the bonding tool which increases the working life of most tools by an order of magnitude and there is no requirement for additional processing.
REFERENCES:
patent: 3986653 (1976-10-01), Gilding
patent: 4513190 (1985-04-01), Ellett et al.
patent: 4974768 (1990-12-01), Ebata
patent: 5474816 (1995-12-01), Falabella
patent: 5516027 (1996-05-01), Tanabe et al.
Hadar Ilan
Sonnenreich Beni
Heinrich Samuel M.
Kulicke and Soffa Investments Inc
Sowell ATY John B.
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