Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-02-20
1998-12-29
Tolin, Gerald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 174 163, 257722, H05K 720
Patent
active
058547398
ABSTRACT:
A heat sink adapted to dissipate heat from an electronic component wherein a plurality of heat dissipating perforated fins project generally outwardly from a planar base and are spaced apart by channels therebetween. The height of the perforated fins to the width of the channels is at least about 8 to 1. The perforations through the fins are such that the flow of cooling fluid through the fins generally emulates the flow through a comparable pin grid array heat sink. The fin structure is such that the fin is structurally supported against deformation, particularly during cross-cutting operations.
REFERENCES:
patent: 4879891 (1989-11-01), Hinshaw
patent: 4884331 (1989-12-01), Hinshaw
patent: 5058665 (1991-10-01), Harada
patent: 5208731 (1993-05-01), Blomquist
patent: 5369301 (1994-11-01), Hayashi
patent: 5381859 (1995-01-01), Minakami
patent: 5421406 (1995-06-01), Furusawa
patent: 5564497 (1996-10-01), Fukuoka
Chow Peter S.
Steiner Ronald E.
International Electronic Research Corp.
Jagger Bruce A.
Tolin Gerald
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