Logic module assembly for confining and directing the flow of co

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

622592, 16510433, 257714, 361699, 439485, H05K 720

Patent

active

052608506

ABSTRACT:
An improved logic module comprises integrated circuit chips located in channels. The channels convey a flow of a cooling fluid or a combination of cooling fluids, bringing the cooling fluid into contact with the integrated circuit chips. Flow blockers and power blades form boundaries of the channels and substantially exclude the undesirable entry or exit of cooling fluids at the boundaries. A support frame holds the logic modules of a cluster of logic modules in a generally parallel relationship. Sealing plates between logic modules and an assembly gasket substantially prevent flow short circuiting. The power blades mate sealably with a horizontal buss to conduct electric power to the module.

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patent: 5014419 (1991-05-01), Cray et al.
patent: 5045975 (1991-09-01), Cray et al.
patent: 5054192 (1991-10-01), Cray et al.
patent: 5063475 (1991-11-01), Balan
patent: 5112232 (1992-05-01), Cray et al.
patent: 5131233 (1992-07-01), Cray et al.

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