Inductor devices – With supporting and/or spacing means between coil and core – Preformed insulation between coil and core
Reexamination Certificate
2006-05-16
2006-05-16
Nguyen, Tuyen T (Department: 2832)
Inductor devices
With supporting and/or spacing means between coil and core
Preformed insulation between coil and core
Reexamination Certificate
active
07046112
ABSTRACT:
The present invention is directed to a logging tool induction coil form having a coating layer, which is easy to form to tight tolerances, bonded to at least a portion of the outer surface of the ceramic hollow cylindrical core. A plurality of parallel circumferential grooves are machined into the coating layer. Since the coating material is easy to machine, the parallel circumferential grooves can be machined to the tight tolerances needed in logging applications at a fraction of the time and cost of machining ceramic-only forms.
REFERENCES:
patent: 2608610 (1952-08-01), Thulin
patent: 3585553 (1971-06-01), Muckelroy et al.
patent: 3909704 (1975-09-01), Schonstedt
patent: 4209686 (1980-06-01), Moglia et al.
patent: 4250399 (1981-02-01), King
patent: 4583062 (1986-04-01), Kameya
patent: 5184692 (1993-02-01), Moriarty
patent: 5426408 (1995-06-01), Jones et al.
patent: 5668475 (1997-09-01), Orban et al.
patent: 5905379 (1999-05-01), Orban et al.
patent: 5959521 (1999-09-01), Kohmura et al.
patent: 6084052 (2000-07-01), Aufdermarsh et al.
patent: 6300762 (2001-10-01), Thomas, Jr. et al.
patent: 6535094 (2003-03-01), Murata et al.
patent: 6577244 (2003-06-01), Clark et al.
Davies Evan L.
San Martin Luis E.
Baker & Botts L.L.P.
Halliburton Energy Service,s Inc.
Morico Paul R.
Nguyen Tuyen T
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