Locking feature and method for manufacturing transfer molded...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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C257S788000, C257S787000, C361S760000, C361S765000

Reexamination Certificate

active

07871864

ABSTRACT:
The invention discloses integrated circuits (ICs), molded IC packages, and to leadframe arrays, package arrays and methods for their manufacture. Leadframe arrays and package arrays used for the manufacture of IC packages by transfer molding processes include a locking feature adapted for encapsulation. The locking feature is situated in a strap of the leadframe array overlying a gate between mold cavities. The strap lock formed by curing encapsulant in the locking feature of the strap strengthens the resulting package array and provides improved mold extraction and handling characteristics.

REFERENCES:
patent: 3650648 (1972-03-01), Lambrecht
patent: 6262490 (2001-07-01), Hsu et al.
patent: 2005/0287715 (2005-12-01), Lum et al.

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