Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-01-18
2011-01-18
Andújar, Leonardo (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S788000, C257S787000, C361S760000, C361S765000
Reexamination Certificate
active
07871864
ABSTRACT:
The invention discloses integrated circuits (ICs), molded IC packages, and to leadframe arrays, package arrays and methods for their manufacture. Leadframe arrays and package arrays used for the manufacture of IC packages by transfer molding processes include a locking feature adapted for encapsulation. The locking feature is situated in a strap of the leadframe array overlying a gate between mold cavities. The strap lock formed by curing encapsulant in the locking feature of the strap strengthens the resulting package array and provides improved mold extraction and handling characteristics.
REFERENCES:
patent: 3650648 (1972-03-01), Lambrecht
patent: 6262490 (2001-07-01), Hsu et al.
patent: 2005/0287715 (2005-12-01), Lum et al.
Andújar Leonardo
Brady III Wade J.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
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