Drying and gas or vapor contact with solids – Apparatus – With apparatus using centrifugal force
Reexamination Certificate
2006-10-31
2006-10-31
Scherbel, David A. (Department: 3752)
Drying and gas or vapor contact with solids
Apparatus
With apparatus using centrifugal force
C034S109000, C034S312000, C034S317000, C034S328000, C034S315000
Reexamination Certificate
active
07127828
ABSTRACT:
A rotor that may be used by itself or in a processing machine for processing semiconductor wafers includes two pairs of combs. A lock down mechanism has a lock bar, temporarily engaged and moved by a loading/unloading robot, drives a retainer against the edges of the wafers, to better hold them in place during processing. Contamination via generation of particles is reduced. Combs on the rotor have a resilient strip. The lower edges of the wafers compress slightly into or deflect the resilient strip, when urged into place by the lock down mechanism.
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Schlagenhauser Ronald
Weaver Robert
Boeckmannn Jason
Perkins Coie LLP
Scherbel David A.
Semitool Inc.
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