Locating defects in solid material

Radiant energy – Infrared-to-visible imaging – Including detector array

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2503414, G01N 2100

Patent

active

059819499

ABSTRACT:
The invention provides method and apparatus for fast, accurate, and nondestructive imaging of defects and determining defect densities in solid materials including a semiconductor wafer. A wafer is illuminated on one side by an infrared (IR) source and a camera is placed on the other side of the wafer, to detect IR radiation that is transmitted through such wafer. The inventive method employs an imaging camera, e.g. a focal plane array camera, to image the so illuminated wafer. The wafer material must be substantially transparent in the camera bandwidth but can contain defects that absorb or scatter radiation in such bandwidth. Camera filters are used, for example, to select specific wavelengths or bands of wavelengths, to detect and image precipitates, subsurface defects, residual damage from polishing and other defects.

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patent: 5126569 (1992-06-01), Carlson
patent: 5512749 (1996-04-01), Iddan et al.
patent: 5528368 (1996-06-01), Lewis et al.

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