Localized soldering station using state changing medium

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces

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228105, 228242, 228 42, B23K 1015

Patent

active

051020289

ABSTRACT:
A localized soldering station is described that uses the vapor phase reflow principle. A container has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit maintains the vapor state while conveying the vapor to a work location where a module with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light. Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve through cooling fins where it changes back to a liquid and returns to the container, avoiding loss.

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patent: 4782991 (1988-11-01), Breu
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patent: 4828162 (1989-05-01), Donner et al.
"Vapor Phase Solder Reflow for Hybrid Circuit Manufacturing", Spigarelli, Solid State Technology, pp. 50-53, Oct. 1976.
3M Fluorinert Electronic Liquids, Commercial Chemicals Division, 2-1984.
IBM Technical Disclosure Bulletin, "Soldering Tool Employing Hot Vapors", vol. 22, No. 5, pp. 1833-1838, Oct. 1979.
Research Disclosure, "Solder Process Monitor", Kenneth Mason Publications Ltd, England, No. 258, Oct. 1985.
IBM Technical Disclosure Bulletin, " . . . Vapor Phase Soldering Equipment", vol. 30, No. 2, pp. 549-551, Jul. 1987.
IBM Technical Disclosure Bulletin, vol. 13, No. 3, "Solvent Vapor Solder Reflow", Aug. 1970, p. 639; by E. G. Dingman.

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