Localized soldering by inductive heating

Details Localized soldering by inductive heating Localized soldering by inductive heating

1989-12-21

1991-01-08

Leung, Philip H.

Electric heating

Metal heating

For bonding with pressure

219 1041, 219 95, 219 1071, H05B 610, B23K 100

Patent

active

049838040

ABSTRACT:
Disclosed is a method for selective soldering of components by inductive heating. A ferromagnetic material is provided as part of the components so that an applied electromagnetic field will create sufficient heat to melt the solder. The Curie temperature of the material is chosen to be just above the melting temperature of the solder to regulate the amount of heating.

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patent: 4795870 (1989-01-01), Krumme
patent: 4806107 (1989-02-01), Arnold et al.

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