Localized microelectronic cooling

Details Localized microelectronic cooling Localized microelectronic cooling

2005-06-30

2008-10-07

Jones, Melvin (Department: 3744)

Refrigeration

Using electrical or magnetic effect

Thermoelectric; e.g., peltier effect

C062S259200

Reexamination Certificate

active

07430870

ABSTRACT:
An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling system comprising one or more thermoelectric cooler(s) is thermally coupled to a heat spreader to provide cooling to one or more hot spot(s) of a microelectronic device.

REFERENCES:
patent: 5456081 (1995-10-01), Chrysler et al.
patent: 6365821 (2002-04-01), Prasher
patent: 6646874 (2003-11-01), Pokharna et al.
patent: 6727422 (2004-04-01), Macris
patent: 6743972 (2004-06-01), Macris
patent: 6845622 (2005-01-01), Sauciuc et al.
Bierschenk et al—Extending the Limits of Air Cooling With Thermoelectrically Enhanced Heat Sinks—2004 Inter Society Conference on Thermal Phenomena.

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