Localized cooling apparatus for cooling integrated circuit devic

Electric power conversion systems – Current conversion – With cooling means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

363147, 357 87, 357 81, 357 28, 361386, 323907, H01L 2504

Patent

active

049358642

ABSTRACT:
A localized cooling apparatus is provided for individually cooling integrated circuit chips mounted on a circuit board for insertion into a computer backplane. The cooling apparatus consists of a circuit board occupying a first slot and having an integrated circuit chip mounted thereon, the performance of which is known to improve by cooling, a heat removal assembly consisting of a heat sink attached to a card edge portion and occupying an adjacent second slot, and a thermoelectric cooler intimately bonded to both the chip and heat removal assembly. A controller provides power via the connector of the second slot to the thermoelectric cooler and stabilizes the temperature of the chip to a predetermined value.

REFERENCES:
patent: 2984077 (1961-05-01), Gaskill
patent: 3289422 (1966-12-01), Fisher
patent: 3400543 (1968-09-01), Ross
patent: 4238759 (1980-12-01), Hunsperger
patent: 4253515 (1981-03-01), Swiatosz
patent: 4279292 (1981-07-01), Swiatosz
patent: 4402185 (1983-09-01), Perchak
patent: 4405961 (1983-09-01), Chow et al.
patent: 4571728 (1986-02-01), Yoshikawa
patent: 4587563 (1986-05-01), Bendell et al.
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4685081 (1987-08-01), Richman
patent: 4689659 (1987-08-01), Watanabe
patent: 4727554 (1988-02-01), Watanabe
patent: 4812733 (1989-03-01), Tobey
patent: 4812949 (1989-03-01), Fontan et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Localized cooling apparatus for cooling integrated circuit devic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Localized cooling apparatus for cooling integrated circuit devic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Localized cooling apparatus for cooling integrated circuit devic will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2264035

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.