Local laser plating apparatus

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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Details

118641, 427597, C25D 1700, B05B 500, B05D 306

Patent

active

052924181

ABSTRACT:
A local plating apparatus includes a fiber, a laser beam penetrating nozzle or a laser beam penetrating mask through which a laser beam can be directly irradiated on a portion to be plated when plating is conducted on the portion to be plated using a jet of plating solution. The apparatus enables a laser beam to reach the portion to be plated in a stable state, and ensures a high plating speed and uniform plating quality.

REFERENCES:
patent: 4497692 (1985-02-01), Gelchinski et al.
patent: 4511595 (1985-04-01), Inoue
patent: 4608138 (1986-08-01), Kobayashi
patent: 4766009 (1988-08-01), Imura et al.
patent: 4826583 (1989-05-01), Biernaux et al.
patent: 4832798 (1989-05-01), Cvijanovich et al.
Gelchinski, M. H., et al, Electrochemical and Metallurgical Aspects of Laser-Enchanced jet Plating of Gold, vol. 132, No. 1 (1985).

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