Metal fusion bonding – Including means to force or clamp work portions together...
Patent
1996-01-16
1998-12-15
Ramsey, Kenneth J.
Metal fusion bonding
Including means to force or clamp work portions together...
228 55, B23K 2002
Patent
active
058487468
ABSTRACT:
A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresses generated for bonding are regulated and self adjusting. The load regulator comprises a pair of friction isolators with a plurality of annealed copper members located therebetween. The device, with the load regulator, will adjust to and maintain a stress level needed to successfully and economically complete a leak tight bond without damaging thin foils or other delicate components.
REFERENCES:
patent: 3110961 (1963-11-01), Melill et al.
patent: 4089456 (1978-05-01), Toppen et al.
patent: 4204628 (1980-05-01), Houston et al.
Truhan et al, "Fabrication of Thin Beryllium Windows for X-Ray Applications", UCRL-83767, Lawrence Livermore Labratory, University of California, Livermore, Ca 94550, USA, Dec. 19, 1979.
Strum Michael J.
Wagner Lawrence M.
Carnahan L. E.
Ramsey Kenneth J.
The Regents of the University of California
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