Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-08-22
2006-08-22
Hammond, Briggitte (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S072000, C174S260000, C361S774000
Reexamination Certificate
active
07094068
ABSTRACT:
A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC for testing connection, such as a quad flat packaged IC (QFP), a dual inline packaged IC (DIP) or a small outline packaged IC (SOP). The bonding pads on the load board connect the leads of the testing IC directly during IC testing, thus the conventional test socket between a conventional load board and a packaged IC is omitted.
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Chen Fu-Tsai
Chou Hsiu-Chu
Huang Ching-Jung
Kuo Pao-Chuan
Liao Mu-Sheng
Birch & Stewart Kolasch & Birch, LLP
Chung-Trans X.
Hammond Briggitte
Silicon Integrated Systems Corp.
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