Lithographic resist composition for a lift-off process

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

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430192, 430193, 430315, 430326, 430329, 430330, G03C 154, G03C 160, G03C 500

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active

042847060

ABSTRACT:
Lithographic resist compositions are provided which permit an improved lift-off process in which the deposition mask with apertures has the desirable negative slope or overhang. The resist composition comprises a phenolic-aldehyde resin, a photosensitizer and Meldrum's diazo, or Meldrum's acid or suitable analogs thereof as a profile modifying agent. The profile modifying agents useful in the present invention have the formula: ##STR1## wherein R.sub.1 is C.sub.1 to C.sub.20 alkyl or aryl, R.sub.2 is H, C.sub.1 to C.sub.20 alkyl or aryl, or together R.sub.1 and R.sub.2 are cycloalkyl, A is N or H.

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Kammula, S., et al., J. Org. Chem., vol. 42, No. 17, pp. 2931-2932, 1977.
Dinaburg, M. S., "Photosensitive Diazo Compounds," Focal Press, pp. 31-32 and 181-182, 1964.

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