Lithographic processing optimization based on hypersampled...

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement

Reexamination Certificate

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C355S077000

Reexamination Certificate

active

10715109

ABSTRACT:
A method of optimizing lithographic processing to achieve substrate uniformity, is presented herein. In one embodiment, The method includes deriving hyper-sampled correlation information indicative of photoresist behavior for a plurality of wafer substrates processed at pre-specified target processing conditions. The derivation includes micro-exposing subfields of the substrates with a pattern, processing the substrates at the various target conditions, determining photoresist-related characteristics of the subfields (e.g., Bossung curvatures), and extracting correlation information regarding the subfield characteristics and the different target processing conditions to relate the target conditions as a function of subfield characteristics. The method then detects non-uniformities in a micro-exposed subsequent substrate-processed under production-level processing conditions and exploits the correlation information to adjust the production-level conditions and achieve uniformity across the substrate.

REFERENCES:
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patent: 6873938 (2005-03-01), Paxton et al.
patent: 6934011 (2005-08-01), Geh et al.
Flagello, Donis G.; van der Laan, Hans; van Schoot, Jan; Bouchoms, Igor; and Geh, Bernd, “Understanding systematic and random cd variations using predicitive modelling techniques,” SPIE Conference on Optical Microlithography XII, Mar. 1999, pp. 162-175, vol. 3679, Santa Clara, California.

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