Lithographic method for wiring a side surface of a substrate

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

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Reexamination Certificate

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07659038

ABSTRACT:
In a lithographic proximity method for wiring an end or internal side surface of a substrate, the required exposure of strips, defining the wiring pattern, is performed by a mask having a diffraction structure to deflect exposure radiation to the side surface. An exposure beam, which is perpendicularly incident on the mask, is used so that enhanced tolerance for proximity gap width variations is obtained. The method allows manufacture of accurate and fine wiring.

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patent: 0602829 (1994-06-01), None
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patent: 11212246 (1999-08-01), None
Ton Nellissen, et al: A Novel Photolithographic Method for Realizing 3-D Interconnection Patterns on Electronic Modules, pp. 1-6.

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