Lithographic contact elements

Details Lithographic contact elements Lithographic contact elements

2007-10-30

2007-10-30

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S843000, C029S874000, C029S876000, C029S884000, C438S014000

Reexamination Certificate

active

10933063

ABSTRACT:
A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

REFERENCES:
patent: 3648355 (1972-03-01), Shida et al.
patent: 3940786 (1976-02-01), Scheingold et al.
patent: 4239312 (1980-12-01), Myer et al.
patent: 4312117 (1982-01-01), Robillard et al.
patent: 4553192 (1985-11-01), Babuka et al.
patent: 4584039 (1986-04-01), Shea
patent: 4615573 (1986-10-01), White et al.
patent: 4961052 (1990-10-01), Tada et al.
patent: 5032896 (1991-07-01), Little et al.
patent: 5137456 (1992-08-01), Desai et al.
patent: 5152695 (1992-10-01), Grabbe
patent: 5177438 (1993-01-01), Littlebury et al.
patent: 5180482 (1993-01-01), Abys et al.
patent: 5191708 (1993-03-01), Kasukabe et al.
patent: 5199889 (1993-04-01), McDevitt, Jr.
patent: 5308443 (1994-05-01), Sugihara
patent: 5342737 (1994-08-01), Georger, Jr. et al.
patent: 5354712 (1994-10-01), Ho et al.
patent: 5391521 (1995-02-01), Kim
patent: 5452268 (1995-09-01), Bernstein
patent: 5465611 (1995-11-01), Ruf et al.
patent: 5469733 (1995-11-01), Yasue et al.
patent: 5475318 (1995-12-01), Marcus et al.
patent: 5476818 (1995-12-01), Yanof et al.
patent: 5513430 (1996-05-01), Yanof et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5536909 (1996-07-01), DiStefano et al.
patent: 5606128 (1997-02-01), Araki
patent: 5613861 (1997-03-01), Smith et al.
patent: 5629137 (1997-05-01), Leedy
patent: 5632631 (1997-05-01), Fjelstad et al.
patent: 5653598 (1997-08-01), Grabbe
patent: 5656941 (1997-08-01), Bishop et al.
patent: 5666190 (1997-09-01), Quate et al.
patent: 5723894 (1998-03-01), Ueno et al.
patent: 5759014 (1998-06-01), Van Lintel
patent: 5776663 (1998-07-01), Roh
patent: 5786270 (1998-07-01), Gorrell et al.
patent: 5787581 (1998-08-01), DiStefano et al.
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5812357 (1998-09-01), Johansen et al.
patent: 5828226 (1998-10-01), Higgins et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5848685 (1998-12-01), Smith et al.
patent: 5897326 (1999-04-01), Eldridge et al.
patent: 5904498 (1999-05-01), Fjelstad
patent: 5914218 (1999-06-01), Smith et al.
patent: 5914614 (1999-06-01), Beaman et al.
patent: 5944537 (1999-08-01), Smith et al.
patent: 5966587 (1999-10-01), Karavakis
patent: 5973394 (1999-10-01), Slocum et al.
patent: 5994152 (1999-11-01), Khandros et al.
patent: 6001663 (1999-12-01), Ling et al.
patent: 6023103 (2000-02-01), Chang et al.
patent: 6031282 (2000-02-01), Jones et al.
patent: 6059982 (2000-05-01), Palagonia et al.
patent: 6072190 (2000-06-01), Watanabe et al.
patent: 6080596 (2000-06-01), Vindasius et al.
patent: 6117694 (2000-09-01), Smith et al.
patent: 6140581 (2000-10-01), Cowan et al.
patent: 6174744 (2001-01-01), Watanabe et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6194291 (2001-02-01), DiStefano et al.
patent: 6204455 (2001-03-01), Gilleo
patent: 6255126 (2001-07-01), Mathieu et al.
patent: 6255585 (2001-07-01), Jones et al.
patent: 6268015 (2001-07-01), Mathieu et al.
patent: 6307392 (2001-10-01), Soejima et al.
patent: 6359455 (2002-03-01), Takekoshi
patent: 6452401 (2002-09-01), Khoury et al.
patent: 6491968 (2002-12-01), Mathieu et al.
patent: 6520778 (2003-02-01), Eldridge et al.
patent: 6521970 (2003-02-01), Takiar et al.
patent: 6616966 (2003-09-01), Mathieu et al.
patent: 6680536 (2004-01-01), Hattori et al.
patent: 6791176 (2004-09-01), Mathieu et al.
patent: 6807734 (2004-10-01), Eldridge et al.
patent: 2001/0012739 (2001-08-01), Grube et al.
patent: 2004/0072452 (2004-04-01), Eldridge et al.
patent: 19736674 (1998-11-01), None
patent: 413042 (1989-08-01), None
patent: 1446196 (1976-08-01), None
patent: 60-025073 (1985-02-01), None
patent: 04-93157 (1992-08-01), None
patent: 04-214650 (1992-08-01), None
patent: 05-198716 (1993-08-01), None
patent: 06-018555 (1994-01-01), None
patent: 07-007052 (1995-01-01), None
patent: 07-021968 (1995-12-01), None
patent: 07-333232 (1995-12-01), None
patent: 09-018118 (1997-01-01), None
patent: 09-203769 (1997-08-01), None
patent: 09-203770 (1997-08-01), None
patent: 10-142259 (1998-05-01), None
patent: WO91/12706 (1991-08-01), None
patent: WO94/09513 (1994-04-01), None
patent: WO96/37332 (1996-11-01), None
patent: WO97/43654 (1997-11-01), None
patent: WO97/44676 (1997-11-01), None
patent: WO98/52224 (1998-11-01), None
Kong et al., “Integrated Electrostatically Resonant Scan Tip For An Atomic Force Microscope,” J. Vac. Sci. Technol. B 11(3), May/Jun. 1993.
Leung et al., “Active Substrate Membrane Probe Card,” Center For Integrated Systems, Stanford University (Oct. 12, 1995).
“Dual-Level Printed Circuit Board Edge Connector,” Research Disclosure 28018, No. 280 (Kenneth Mason Publications Ltd., Aug. 1987 England.

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