Lithographic apparatus and device manufacturing method

Details Lithographic apparatus and device manufacturing method Lithographic apparatus and device manufacturing method

2007-01-22

2009-06-16

Rutledge, Della J. (Department: 2851)

Photocopying

Projection printing and copying cameras

Illumination systems or details

C355S069000, C355S071000

Reexamination Certificate

active

07548302

ABSTRACT:
A method of transferring an image of a pattern layout onto a surface of a substrate including selecting a first illumination profile for a first area of the pattern layout and a second illumination profile for a second area of the pattern layout; switching illumination profile during transfer of the image of the pattern layout such that the first area of the pattern layout is illuminated with the first illumination profile and the second area is illuminated with the second illumination profile; and projecting an image of the illuminated first and second areas onto the surface of the substrate.

REFERENCES:
patent: 5041882 (1991-08-01), Katoh
patent: 5115335 (1992-05-01), Soref
patent: 5178445 (1993-01-01), Moddel et al.
patent: 5229872 (1993-07-01), Mumola
patent: 5296891 (1994-03-01), Vogt et al.
patent: 5305054 (1994-04-01), Suzuki et al.
patent: 5377037 (1994-12-01), Branz et al.
patent: 5523193 (1996-06-01), Nelson
patent: 5638211 (1997-06-01), Shiraishi
patent: 5668023 (1997-09-01), Goossen et al.
patent: 5673103 (1997-09-01), Inoue et al.
patent: 5969441 (1999-10-01), Loopstra et al.
patent: 6046792 (2000-04-01), Van Der Werf et al.
patent: 6323507 (2001-11-01), Yokoyama et al.
patent: 6346979 (2002-02-01), Ausschnitt et al.
patent: 6413684 (2002-07-01), Stanton
patent: 6429440 (2002-08-01), Bleeker
patent: 6452662 (2002-09-01), Mulkens et al.
patent: 6466304 (2002-10-01), Smith
patent: 6511869 (2003-01-01), Colgan et al.
patent: 6633366 (2003-10-01), De Jager et al.
patent: 6737662 (2004-05-01), Mulder et al.
patent: 6738128 (2004-05-01), Shima et al.
patent: 6741331 (2004-05-01), Boonman et al.
patent: 6758608 (2004-07-01), Van Arendonk et al.
patent: 6778746 (2004-08-01), Charlton et al.
patent: 6795163 (2004-09-01), Finders
patent: 6833907 (2004-12-01), Eurlings et al.
patent: 6844927 (2005-01-01), Stokowski et al.
patent: 6847461 (2005-01-01), Latypov et al.
patent: 6855486 (2005-02-01), Finders et al.
patent: 6871337 (2005-03-01), Socha
patent: 6887625 (2005-05-01), Baselmans et al.
patent: 7027130 (2006-04-01), Spence et al.
patent: 2002/0027648 (2002-03-01), Van Der Laan et al.
patent: 2002/0180943 (2002-12-01), Mulkens et al.
patent: 2004/0222418 (2004-11-01), Mochizuki
patent: 2004/0229133 (2004-11-01), Socha et al.
patent: 2004/0265707 (2004-12-01), Socha
patent: 2005/0134822 (2005-06-01), Socha et al.
patent: 2005/0142470 (2005-06-01), Socha et al.
patent: 2006/0098181 (2006-05-01), Case et al.
patent: 2007/0013890 (2007-01-01), Loopstra et al.
patent: 2008/0007706 (2008-01-01), Reisinger et al.
patent: 0 500 393 (1997-11-01), None
patent: 0 486 316 (2000-04-01), None
patent: 0 496 891 (2000-04-01), None
patent: 6-196388 (1994-07-01), None
patent: 2001-338866 (2001-12-01), None
patent: 2001-338886 (2001-12-01), None
patent: 2006-135332 (2006-05-01), None
patent: 98/33096 (1998-07-01), None
patent: 98/38597 (1998-09-01), None
patent: 98/40791 (1998-09-01), None
patent: 0077861 (2000-12-01), None
Near 0.3 k1 Full Pitch Range Contact Hole Patterning Using Chroeless Phase Lithography (CPL) by Broeke et al.; SPIE Proceedings vol. 5256 Jan. 2003.
English translation of Japanese Official Action issued on Feb. 10, 2009 in Japanese Application No. 2006-086914.

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