Lithographic apparatus and device manufacturing method

Photocopying – Projection printing and copying cameras – Step and repeat

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C355S030000

Reexamination Certificate

active

07433016

ABSTRACT:
An immersion lithographic apparatus has adaptations to prevent or reduce bubble formation in one or more gaps in the substrate table by preventing bubbles escaping from the gap into the beam path and/or extracting bubbles that may form in the gap.

REFERENCES:
patent: 3573975 (1971-04-01), Dhaka et al.
patent: 3648587 (1972-03-01), Stevens
patent: 4346164 (1982-08-01), Tabarelli et al.
patent: 4390273 (1983-06-01), Loebach et al.
patent: 4396705 (1983-08-01), Akeyama et al.
patent: 4480910 (1984-11-01), Takanashi et al.
patent: 4509852 (1985-04-01), Tabarelli et al.
patent: 5040020 (1991-08-01), Rauschenbach et al.
patent: 5121256 (1992-06-01), Corle et al.
patent: 5610683 (1997-03-01), Takahashi
patent: 5825043 (1998-10-01), Suwa
patent: 5900354 (1999-05-01), Batchelder
patent: 6191429 (2001-02-01), Suwa
patent: 6236634 (2001-05-01), Lee et al.
patent: 6600547 (2003-07-01), Watson et al.
patent: 6603130 (2003-08-01), Bisschops et al.
patent: 6867844 (2005-03-01), Vogel et al.
patent: 7053983 (2006-05-01), Tokita
patent: 2002/0020821 (2002-02-01), Van Santen et al.
patent: 2002/0163629 (2002-11-01), Switkes et al.
patent: 2003/0123040 (2003-07-01), Almogy
patent: 2004/0000627 (2004-01-01), Schuster
patent: 2004/0075895 (2004-04-01), Lin
patent: 2004/0114117 (2004-06-01), Bleeker
patent: 2004/0136494 (2004-07-01), Lof et al.
patent: 2004/0160582 (2004-08-01), Lof et al.
patent: 2004/0165159 (2004-08-01), Lof et al.
patent: 2004/0207824 (2004-10-01), Lof et al.
patent: 2004/0211920 (2004-10-01), Derksen et al.
patent: 2004/0239954 (2004-12-01), Bischoff
patent: 2004/0257544 (2004-12-01), Vogel et al.
patent: 2004/0263809 (2004-12-01), Nakano
patent: 2005/0007569 (2005-01-01), Streefkerk et al.
patent: 2005/0018155 (2005-01-01), Cox et al.
patent: 2005/0024609 (2005-02-01), De Smit et al.
patent: 2005/0030497 (2005-02-01), Nakamura
patent: 2005/0046813 (2005-03-01), Streefkerk et al.
patent: 2005/0046934 (2005-03-01), Ho et al.
patent: 2005/0052632 (2005-03-01), Miyajima
patent: 2005/0094116 (2005-05-01), Flagello et al.
patent: 2005/0094125 (2005-05-01), Arai
patent: 2005/0122505 (2005-06-01), Miyajima
patent: 2005/0132914 (2005-06-01), Mulkens et al.
patent: 2005/0134817 (2005-06-01), Nakamura
patent: 2005/0140948 (2005-06-01), Tokita
patent: 2005/0146693 (2005-07-01), Ohsaki
patent: 2005/0146694 (2005-07-01), Tokita
patent: 2005/0151942 (2005-07-01), Kawashima
patent: 2005/0175776 (2005-08-01), Streefkerk et al.
patent: 2005/0175940 (2005-08-01), Dierichs
patent: 2005/0200815 (2005-09-01), Akamatsu
patent: 2005/0213065 (2005-09-01), Kitaoka
patent: 2005/0213066 (2005-09-01), Sumiyoshi
patent: 2005/0219489 (2005-10-01), Nei et al.
patent: 2005/0225734 (2005-10-01), De Smit et al.
patent: 2005/0233081 (2005-10-01), Tokita
patent: 2006/0038968 (2006-02-01), Kemper et al.
patent: 2006/0087630 (2006-04-01), Kemper et al.
patent: 206 607 (1984-02-01), None
patent: 221 563 (1985-04-01), None
patent: 224 448 (1985-07-01), None
patent: 242 880 (1987-02-01), None
patent: 0023231 (1981-02-01), None
patent: 0418427 (1991-03-01), None
patent: 1039511 (2000-09-01), None
patent: 1 628 163 (2006-02-01), None
patent: 1 788 617 (2007-05-01), None
patent: 1 801 850 (2007-06-01), None
patent: 2474708 (1981-07-01), None
patent: 58-202448 (1983-11-01), None
patent: 62-065326 (1987-03-01), None
patent: 62-121417 (1987-06-01), None
patent: 63-157419 (1988-06-01), None
patent: 04-305915 (1992-10-01), None
patent: 04-305917 (1992-10-01), None
patent: 06-124873 (1994-05-01), None
patent: 07-132262 (1995-05-01), None
patent: 07-220990 (1995-08-01), None
patent: 10-228661 (1998-08-01), None
patent: 10-255319 (1998-09-01), None
patent: 10-303114 (1998-11-01), None
patent: 10-340846 (1998-12-01), None
patent: 11-176727 (1999-07-01), None
patent: 2000-058436 (2000-02-01), None
patent: 2001-091849 (2001-04-01), None
patent: 2004-193252 (2004-07-01), None
patent: WO 99/49504 (1999-09-01), None
patent: WO 2004/053596 (2004-06-01), None
patent: WO 2004/053950 (2004-06-01), None
patent: WO 2004/053951 (2004-06-01), None
patent: WO 2004/053952 (2004-06-01), None
patent: WO 2004/053953 (2004-06-01), None
patent: WO 2004/053954 (2004-06-01), None
patent: WO 2004/053955 (2004-06-01), None
patent: WO 2004/053956 (2004-06-01), None
patent: WO 2004/053957 (2004-06-01), None
patent: WO 2004/053958 (2004-06-01), None
patent: WO 2004/053959 (2004-06-01), None
patent: WO 2004/055803 (2004-07-01), None
patent: WO 2004/057589 (2004-07-01), None
patent: WO 2004/057590 (2004-07-01), None
patent: WO 2004/090577 (2004-10-01), None
patent: WO 2004/090633 (2004-10-01), None
patent: WO 2004/090634 (2004-10-01), None
patent: WO 2004/092830 (2004-10-01), None
patent: WO 2004/092833 (2004-10-01), None
patent: WO 2004/093130 (2004-10-01), None
patent: WO 2004/093159 (2004-10-01), None
patent: WO 2004/093160 (2004-10-01), None
patent: WO 2004/095135 (2004-11-01), None
patent: WO 2005/010611 (2005-02-01), None
patent: WO 2005/024517 (2005-03-01), None
patent: WO 2005/048328 (2005-05-01), None
M. Switkes et al., “Immersion Lithography at 157 nm”, MIT Lincoln Lab, Orlando 2001-1, Dec. 17, 2001.
M. Switkes et al., “Immersion Lithography at 157 nm”, J. Vac. Sci. Technol. B., vol. 19, No. 6, Nov./Dec. 2001, pp. 2353-2356.
M. Switkes et al., “Immersion Lithgraphy: Optics for the 50 nm Node”, 157 Anvers-1, Sep. 4, 2002.
B.J. Lin, “Drivers, Prospects and Challenges for Immersion Lithography”, TSMC, Inc., Sep. 2002.
B.J. Lin, “Proximity Printing Through Liquid”, IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978, p. 4997.
B.J. Lin, “The Paths To Subhalf-Micrometer Optical Lithography”, SPIE vol. 922, Optical/Laser Microlithography (1988), pp. 256-269.
G.W.W. Stevens, “Reduction of Waste Resulting from Mask Defects”, Solid State Technology, Aug. 1978, vol. 21 008, pp. 68-72.
S. Owa et al., “Immersion Lithography; its potential performance and issues”, SPIE Microlithography 2003, 5040-186, Feb. 27, 2003.
S. Owa et al., “Advantage and Feasibility of Immersion Lithography”, Proc. SPIE 5040 (2003).
Nikon Precision Europe GmbH, “Investor Relations—Nikon's Real Solutions”, May 15, 2003.
H. Kawata et al., “Optical Projection Lithography using Lenses with Numerical Apertures Greater than Unity”, Microelectronic Engineering 9 (1989), pp. 31-36.
J.A. Hoffnagle et al., “Liquid Immersion Deep-Ultraviolet Interferometric Lithography”, J. Vac. Sci. Technol. B., vol. 17, No. 6, Nov./Dec. 1999, pp. 3306-3309.
B.W. Smith et al., “Immersion Optical Lithography at 193nm”, Future Fab International, vol. 15, Jul. 11, 2003.
H. Kawata et al., “Fabrication of 0.2 μm Fine Patterns Using Optical Projection Lithography with an Oil Immersion Lens”, Jpn. J. Appl. Phys. vol. 31 (1992), pp. 4174-4177.
G. Owen et al., “1/8 μm Optical Lithography”, J. Vac. Sci. Technol. B., vol. 10, No. 6, Nov./Dec. 1992, pp. 3032-3036.
H. Hogan, “New Semiconductor Lithography Makes a Splash”, Photonics Spectra, Photonics TechnologyWorld, Oct. 2003 Edition, pp. 1-3.
S. Owa and N. Nagasaka, “Potential Performance and Feasibility of Immersion Lithography”, NGL Workshop 2003, Jul. 10, 2003, Slide Nos. 1-33.
S. Owa et al., “Update on 193nm immersion exposure tool”, Litho Forum, International SEMATECH, Los Angeles, Jan. 27-29, 2004, Slide Nos. 1-51.
H. Hata, “The Development of Immersion Exposure Tools”, Litho Forum, International SEMATECH, Los Angeles, Jan. 27-29, 2004, Slide Nos. 1-22.
T. Matsuyama et al., “Nikon Projection Lens Update”, SPIE Microlithography 2004, 5377-65, Mar. 2004.
“Depth-of-Focus Enhancement Using High Refractive Index Layer on the Imaging Layer”, IBM Technical Disclosure Bulletin, vol. 27, No. 11, Apr. 1985, p. 6521.
A. Suzuki, “Lithography Advances on Multiple Fronts”, EEdesign, EE Times, Jan. 5, 2004.
B. Lin, The κ3coefficient in nonparax

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Lithographic apparatus and device manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lithographic apparatus and device manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lithographic apparatus and device manufacturing method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3991144

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.