Lithographic apparatus and device manufacturing method

Details Lithographic apparatus and device manufacturing method Lithographic apparatus and device manufacturing method

2008-04-29

2008-04-29

Rutledge, D. (Department: 2851)

Photocopying

Projection printing and copying cameras

Step and repeat

C355S072000, C355S075000, C430S005000, C430S030000

Reexamination Certificate

active

11006550

ABSTRACT:
A lithographic apparatus for immersion lithography is disclosed in which a seal between different parts of the substrate table may be arranged to reduce the transmission of forces between the different parts.

REFERENCES:
patent: 3573975 (1971-04-01), Dhaka et al.
patent: 3648587 (1972-03-01), Stevens
patent: 4346164 (1982-08-01), Tabarelli et al.
patent: 4390273 (1983-06-01), Loebach et al.
patent: 4396705 (1983-08-01), Akeyama et al.
patent: 4480910 (1984-11-01), Takanashi et al.
patent: 4509852 (1985-04-01), Tabarelli et al.
patent: 5040020 (1991-08-01), Rauschenbach et al.
patent: 5121256 (1992-06-01), Corle et al.
patent: 5610683 (1997-03-01), Takahashi
patent: 5715039 (1998-02-01), Fukuda et al.
patent: 5825043 (1998-10-01), Suwa
patent: 5900354 (1999-05-01), Batchelder
patent: 6191429 (2001-02-01), Suwa
patent: 6236634 (2001-05-01), Lee et al.
patent: 6560032 (2003-05-01), Hatano
patent: 6597433 (2003-07-01), Renkens et al.
patent: 6600547 (2003-07-01), Watson et al.
patent: 6603130 (2003-08-01), Bisschops et al.
patent: 6633365 (2003-10-01), Suenaga
patent: 2002/0020821 (2002-02-01), Van Santen et al.
patent: 2002/0163629 (2002-11-01), Switkes et al.
patent: 2003/0123040 (2003-07-01), Almogy
patent: 2003/0174408 (2003-09-01), Rostalski et al.
patent: 2004/0000627 (2004-01-01), Schuster
patent: 2004/0021844 (2004-02-01), Suenaga
patent: 2004/0075895 (2004-04-01), Lin
patent: 2004/0109237 (2004-06-01), Epple et al.
patent: 2004/0114117 (2004-06-01), Bleeker
patent: 2004/0119954 (2004-06-01), Kawashima et al.
patent: 2004/0125351 (2004-07-01), Krautschik et al.
patent: 2004/0135099 (2004-07-01), Simon et al.
patent: 2004/0136494 (2004-07-01), Lof et al.
patent: 2004/0160582 (2004-08-01), Lof et al.
patent: 2004/0165159 (2004-08-01), Lof et al.
patent: 2004/0207824 (2004-10-01), Lof et al.
patent: 2004/0211920 (2004-10-01), Derksen et al.
patent: 2004/0239954 (2004-12-01), Bischoff
patent: 2004/0263809 (2004-12-01), Nakano
patent: 2005/0007569 (2005-01-01), Streefkerk et al.
patent: 2005/0018155 (2005-01-01), Cox et al.
patent: 2005/0025609 (2005-02-01), De Smit et al.
patent: 2005/0030497 (2005-02-01), Nakamura
patent: 2005/0046813 (2005-03-01), Streefkerk et al.
patent: 2005/0046934 (2005-03-01), Ho et al.
patent: 2005/0052632 (2005-03-01), Miyajima
patent: 2005/0094125 (2005-05-01), Arai
patent: 2005/0122505 (2005-06-01), Miyajima
patent: 2005/0134817 (2005-06-01), Nakamura
patent: 2005/0140948 (2005-06-01), Tokita
patent: 2005/0146693 (2005-07-01), Ohsaki
patent: 2005/0146694 (2005-07-01), Tokita
patent: 2005/0151942 (2005-07-01), Kawashima
patent: 2005/0200815 (2005-09-01), Akamatsu
patent: 2005/0213065 (2005-09-01), Kitaoka
patent: 2005/0213066 (2005-09-01), Sumiyoshi
patent: 2005/0219489 (2005-10-01), Nei et al.
patent: 2005/0233081 (2005-10-01), Tokita
patent: 206 607 (1984-02-01), None
patent: 221 563 (1985-04-01), None
patent: 224448 (1985-07-01), None
patent: 242880 (1987-02-01), None
patent: 0023231 (1981-02-01), None
patent: 0418427 (1991-03-01), None
patent: 0 860 861 (1998-08-01), None
patent: 1039511 (2000-09-01), None
patent: 1 429 188 (2004-06-01), None
patent: 1 586 948 (2005-10-01), None
patent: 2474708 (1981-07-01), None
patent: 58-202448 (1983-11-01), None
patent: 62-065326 (1987-03-01), None
patent: 62-121417 (1987-06-01), None
patent: 63-157419 (1988-06-01), None
patent: 04-305915 (1992-10-01), None
patent: 04-305917 (1992-10-01), None
patent: 06-124873 (1994-05-01), None
patent: 07-132262 (1995-05-01), None
patent: 07-220990 (1995-08-01), None
patent: 10-228661 (1998-08-01), None
patent: 10-255319 (1998-09-01), None
patent: 10-303114 (1998-11-01), None
patent: 10-340846 (1998-12-01), None
patent: 11-176727 (1999-07-01), None
patent: 2000-058436 (2000-02-01), None
patent: 2001-091849 (2001-04-01), None
patent: 2004-193252 (2004-07-01), None
patent: 2005116571 (2005-04-01), None
patent: WO 99/49504 (1999-09-01), None
patent: WO 03/077036 (2003-09-01), None
patent: WO 03/077037 (2003-09-01), None
patent: WO 2004/019128 (2004-03-01), None
patent: WO 2004/053596 (2004-06-01), None
patent: WO 2004/053950 (2004-06-01), None
patent: WO 2004/053951 (2004-06-01), None
patent: WO 2004/053952 (2004-06-01), None
patent: WO 2004/053953 (2004-06-01), None
patent: WO 2004/053954 (2004-06-01), None
patent: WO 2004/053955 (2004-06-01), None
patent: WO 2004/053956 (2004-06-01), None
patent: WO 2004/053957 (2004-06-01), None
patent: WO 2004/053958 (2004-06-01), None
patent: WO 2004/053959 (2004-06-01), None
patent: WO 2004/055803 (2004-07-01), None
patent: WO 2004/057589 (2004-07-01), None
patent: WO 2004/057590 (2004-07-01), None
patent: WO 2004/090577 (2004-10-01), None
patent: WO 2004/090633 (2004-10-01), None
patent: WO 2004/090634 (2004-10-01), None
patent: WO 2004/092830 (2004-10-01), None
patent: WO 2004/092833 (2004-10-01), None
patent: WO 2004/093130 (2004-10-01), None
patent: WO 2004/093159 (2004-10-01), None
patent: WO 2004/093160 (2004-10-01), None
patent: WO 2004/095135 (2004-11-01), None
patent: WO 2005/010611 (2005-02-01), None
patent: WO 2005/024517 (2005-03-01), None
European Search Report for European Application No. 05 25 7410, dated May 15, 2006.
U.S. Appl. No. 10/698,012, filed Oct. 31, 2003, Flagello et al.
U.S. Appl. No. 10/743,271, filed Dec. 23, 2003, Van Santen et al.
U.S. Appl. No. 10/743,266, filed Dec. 23, 2003, Mulkens et al.
U.S. Appl. No. 10/719,683, filed Nov. 24, 2003, Streefkerk et al.
U.S. Appl. No. 10/367,910, filed Feb. 19, 2003, Suwa et al.
M. Switkes et al., “Immersion Lithography at 157 nm”, MIT Lincoln Lab, Orlando 2001-1, Dec. 17, 2001.
M. Switkes et al., “Immersion Lithography at 157 nm”, J. Vac. Sci. Technol. B., vol. 19, No. 6, Nov./Dec. 2001, pp. 2353-2356.
M. Switkes et al., “Immersion Lithography: Optics for the 50 nm Node”, 157 Anvers-1, Sep. 4, 2002.
B.J. Lin, “Drivers, Prospects and Challenges for Immersion Lithography”, TSMC, Inc., Sep. 2002.
B.J. Lin, “Proximity Printing Through Liquid”, IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978, p. 4997.
B.J. Lin, “The Paths To Subhalf-Micrometer Optical Lithography”, SPIE vol. 922, Optical/Laser Microlithography (1988), pp. 256-269.
G.W.W. Stevens, “Reduction of Waste Resulting from Mask Defects”, Solid State Technology, Aug. 1978, vol. 21 008, pp. 68-72.
S. Owa et al., “Immersion Lithography; its potential performance and issues”, SPIE Microlithography 2003, 5040-186, Feb. 27, 2003.
S. Owa et al., “Advantage and Feasibility of Immersion Lithography”, Proc. SPIE 5040 (2003).
Nikon Precision Europe GmbH, “Investor Relations—Nikon's Real Solutions”, May 15, 2003.
H. Kawata et al., “Optical Projection Lithography using Lenses with Numerical Apertures Greater than Unity”, Microelectronic Engineering 9 (1989), pp. 31-36.
J.A. Hoffnagle et al., “Liquid Immersion Deep-Ultraviolet Interferometric Lithography”, J. Vac. Sci. Technol. B., vol. 17, No. 6, Nov./Dec. 1999, pp. 3306-3309.
B.W. Smith et al., “Immersion Optical Lithography at 193nm”, Future Fab International, vol. 15, Jul. 11, 2003.
H. Kawata et al., “Fabrication of 0.2μm Fine Patterns Using Optical Projection Lithography with an Oil Immersion Lens”, Jpn. J. Appl. Phys. vol. 31 (1992), pp. 4174-4177.
G. Owen et al., “1/8μm Optical Lithography”, J. Vac. Sci. Technol. B., vol. 10, No. 6, Nov./Dec. 1992, pp. 3032-3036.
H. Hogan, “New Semiconductor Lithography Makes a Splash”, Photonics Spectra, Photonics TechnologyWorld, Oct. 2003 Edition, pp. 1-3.
S. Owa and N. Nagasaka, “Potential Performance and Feasibility of Immersion Lithography”, NGL Workshop 2003, Jul. 10, 2003, Slide Nos. 1-33.
S. Owa et al., “Update on 193nm immersion exposure tool”, Litho Forum, International SEMATECH, Los Angeles, Jan. 27-29, 2004, Slide Nos. 1-51.
H. Hata, “The Development of Immersion Exposure Tools”, Litho Forum, International SEMATECH, Los Angeles, J

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