Lithographic apparatus

Photocopying – Projection printing and copying cameras – Step and repeat

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C355S072000, C356S401000

Reexamination Certificate

active

07113258

ABSTRACT:
A lithographic projection apparatus is provided with an optical system built into the wafer table for producing an image of a wafer mark that is provided on the back side of the wafer. The image is located at the plane of the front side of the wafer and can be viewed by an alignment system from the front side of the wafer. Simultaneous alignment between marks on the back and front of the wafer and a mask can be performed using a pre-existing alignment system. The lithographic projection apparatus is further provided with immersion system for providing a fluid between the lens and the substrate.

REFERENCES:
patent: 3752589 (1973-08-01), Kobayashi
patent: 4046985 (1977-09-01), Gates
patent: 4408875 (1983-10-01), Majima
patent: 4492459 (1985-01-01), Omata
patent: 4650983 (1987-03-01), Suwa
patent: 4798470 (1989-01-01), Moriyama et al.
patent: 4853745 (1989-08-01), Kamiya et al.
patent: 4952060 (1990-08-01), Ina et al.
patent: 5229872 (1993-07-01), Mumola
patent: 5296891 (1994-03-01), Vogt et al.
patent: 5298988 (1994-03-01), Everett et al.
patent: 5361132 (1994-11-01), Farn
patent: 5483348 (1996-01-01), Komatsu et al.
patent: 5523193 (1996-06-01), Nelson
patent: 5530552 (1996-06-01), Mermagen et al.
patent: 5715039 (1998-02-01), Fukuda et al.
patent: 5721605 (1998-02-01), Mizutani
patent: 5777747 (1998-07-01), Tanaka
patent: 5843831 (1998-12-01), Chung et al.
patent: 5874190 (1999-02-01), Tanaka
patent: 5894530 (1999-04-01), Wilt
patent: 5923990 (1999-07-01), Miura
patent: 5929973 (1999-07-01), Kakizaki et al.
patent: 5929997 (1999-07-01), Lin
patent: 5969441 (1999-10-01), Loopstra et al.
patent: 5985764 (1999-11-01), Lin et al.
patent: 6046792 (2000-04-01), Van Der Werf et al.
patent: 6376329 (2002-04-01), Sogard et al.
patent: 6401008 (2002-06-01), Ehrichs et al.
patent: 6417068 (2002-07-01), Bruce et al.
patent: 6441504 (2002-08-01), Glenn et al.
patent: 6525805 (2003-02-01), Heinle
patent: 6555441 (2003-04-01), Ouellet
patent: 6566146 (2003-05-01), Pang
patent: 6768539 (2004-07-01), Gui et al.
patent: 2001/0032987 (2001-10-01), Narui et al.
patent: 2001/0054723 (2001-12-01), Narui et al.
patent: 2002/0163629 (2002-11-01), Switkes et al.
patent: 2003/0168429 (2003-09-01), Lai et al.
patent: 0 756 207 (1997-01-01), None
patent: 51-093849 (1976-08-01), None
patent: 53143171 (1978-12-01), None
patent: 60141235 (1985-07-01), None
patent: 62160722 (1987-07-01), None
patent: 62160723 (1987-07-01), None
patent: 62160772 (1987-07-01), None
patent: 62254423 (1987-11-01), None
patent: 1-164032 (1989-06-01), None
patent: 01185922 (1989-07-01), None
patent: 01-264975 (1989-10-01), None
patent: 3-246923 (1991-11-01), None
patent: 05021317 (1993-01-01), None
patent: 05062871 (1993-03-01), None
patent: 05114543 (1993-05-01), None
patent: 08083753 (1996-03-01), None
patent: 08111372 (1996-04-01), None
patent: 09139342 (1997-05-01), None
patent: 09312248 (1997-12-01), None
patent: 10-187937 (1998-07-01), None
patent: 10-209030 (1998-08-01), None
patent: 2000299276 (2000-10-01), None
patent: 2002184665 (2002-06-01), None
patent: 2002237588 (2002-08-01), None
patent: 2002280287 (2002-09-01), None
patent: 2003-279318 (2003-10-01), None
patent: WO98/33096 (1998-07-01), None
patent: WO98/38597 (1998-09-01), None
patent: WO98/40791 (1998-09-01), None
Patent Abstract of Japan, JP11340120, published Dec. 1999.
Patent Abstract of Japan, JP05144702, published Jun. 1993.
Patent Abstract of Japan, JP3246923, published Nov. 1991.
Patent Abstract of Japan, JP1164032, published Jun. 1989.
Katagiri et al., “Novel alignment technique for 0.1-μm lithography using the wafer rear surface and canceling tilt effect,”Optical Engineering32(10):2344-2349 (1993).
Everett et al., “Aligning lithography on opposite surfaces of a substrate,”Applied Optics31(34):7292-7294 (1992).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Lithographic apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lithographic apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lithographic apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3580588

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.