Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1984-02-03
1986-08-12
Simmons, David
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
53415, 53137, 156256, 156265, 156322, 156489, 156521, 156566, 156568, B65B 1934
Patent
active
046054596
ABSTRACT:
A system for securing literature to a container by means of a band segment includes a supply of banding material, drawing rollers for drawing out a predetermined length of band segment and a knife for cutting it off. A dispenser of the literature and a conveyor of containers are set in proximity with a carousel which carries an applicator head. The applicator head picks up the band segment by suction, then receives the literature by further use of suction, and finally places the literature and the band segment against the container by release of the suction and a sweeping movement of arms extending from the applicator head to the container. The band segment is supplied with a thermo-sensitive adhesive for effecting an adhesive bond to the container. The applicator head includes heaters for activating the adhesive over only that portion of the band segment which is to adhere to the container.
REFERENCES:
patent: 2107311 (1938-02-01), Strickler
patent: 3030262 (1962-04-01), Gunter
patent: 3138500 (1964-06-01), Fairest
patent: 3531354 (1970-09-01), Hetzinger
patent: 3532583 (1970-10-01), Thiele
patent: 4233331 (1980-01-01), Lemke et al.
patent: 4293369 (1981-10-01), Dilot et al.
patent: 4384915 (1983-05-01), Utsumi
Schwenzer Alfred F.
Voltmer Helmut
Baxley Charles E.
New Jersey Machine Inc.
Simmons David
LandOfFree
Literature applying machine and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Literature applying machine and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Literature applying machine and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1934527