Electrical connectors – With provision to dissipate – remove – or block the flow of heat
Reexamination Certificate
2006-05-16
2006-05-16
Le, Thanh-Tam (Department: 2839)
Electrical connectors
With provision to dissipate, remove, or block the flow of heat
C439S196000
Reexamination Certificate
active
07044768
ABSTRACT:
A liquid thermal management socket system for thermally managing an electronic device in a socket. The liquid thermal management socket system includes a thermal management unit having a chamber for receiving one or more electronic devices, a plurality of first connectors within the thermal management unit for electrically coupling with the electronic device, and a plurality of second connectors electrically coupled to the first connectors, wherein the second connectors extend from the thermal management unit for electrically coupling within a socket unit on a board. The thermal management unit may have a cap member attachable to a base portion in a sealed manner. The chamber within the thermal management unit may thermally manage an electronic device within via spray cooling, liquid immersion or other liquid cooling method.
REFERENCES:
patent: 5475317 (1995-12-01), Smith
patent: 5702256 (1997-12-01), Severn
patent: 6054676 (2000-04-01), Wall et al.
patent: 6410982 (2002-06-01), Brownell et al.
patent: 6469895 (2002-10-01), Smith et al.
patent: 6529378 (2003-03-01), Wong et al.
patent: 6543246 (2003-04-01), Wayburn et al.
patent: 6672881 (2004-01-01), Evans
patent: 6712621 (2004-03-01), Li et al.
patent: 6752204 (2004-06-01), Dishongh et al.
patent: 6932635 (2005-08-01), Ishikawa et al.
Knaggs David H.
Knight Paul A.
Tilton Donald E.
Isothermal Systems Research Inc.
Le Thanh-Tam
Neustel Michael
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