Liquid thermal cycling methods and apparatus

Thermal measuring and testing – Thermal testing of a nonthermal quantity – Of susceptibility to thermally induced deteriouration – flaw,...

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374141, 738656, 165 61, 165108, 165 481, G01N 2572, G01N 2500

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active

052901017

ABSTRACT:
Circuit packs to be tested are loaded into first and second test chambers commonly served by a hot liquid reservoir and by a cold liquid reservoir of which both are coupled to both chambers by a liquid handling system containing valves controlled by program determined signals from a controller unit to direct liquid flows as desired between the chambers and reservoirs. During liquid contact periods for the chambers, liquid from the hot reservoir is intermittently pumped into each of the chambers at times different for the two chambers, and liquid from the cold reservoir is intermittently pumped into each of the chambers at times which are different for the two chambers and intervening at each chamber the times of hot liquid pumping thereto, whereby the packs in each chamber are alternately heated and chilled by such liquid so as to be thermally stressed, and the responses of the packs to such stressing are detected. After completion of the liquid contact periods, an air handling system common to both chambers is used to dry the chambers and the packs therein, to reclaim liquid absorbed as vapor in the air during such drying and to cool the dried articles to a comfortable temperature for unloading from the chambers.

REFERENCES:
patent: 4729246 (1988-03-01), Melgaard et al.
patent: 4733973 (1988-03-01), Machak et al.
patent: 5039228 (1991-08-01), Chalmers
patent: 5167451 (1992-12-01), Muller et al.
"Baised Thermal Shock Liquid System", Thermodynamic, Engineering Management, Feb./Mar. 1991, p. 21.
"Thermal Accelerated Reliability Go-no-go Environmental Testing (TARGET) Dynamic Board Thermal Shock Using a Single Fluid & Bath" by Bradford P. Beaton, NCR Corp., IEEE Sep. 1991.

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