Liquid seeders for electroless metal deposition

Details Liquid seeders for electroless metal deposition Liquid seeders for electroless metal deposition

1979-03-30

1980-09-16

Kendall, Ralph S.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

427304, 427306, C23C 302

Patent

active

042227780

ABSTRACT:
Novel liquid seeders and catalyzation processes for the electroless deposition of metal on substrates. The seeders comprise the admixture of sources of cuprous, hydrogen and halogen ions, organic solvent(s), and an agent to convert cupric ions to cuprous ions. The processes include the steps of contacting a substrate with a certain seeder, fixing the seeder to the substrate with water, and catalyzing the fixed seeder by further water treatment, use of a strong reducing agent, or both.

REFERENCES:
patent: 4020197 (1977-04-01), Steffen

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