Liquid-sealed semiconductor pressure sensor and manufacturing me

Details Liquid-sealed semiconductor pressure sensor and manufacturing me Liquid-sealed semiconductor pressure sensor and manufacturing me

1995-02-24

1997-01-21

Picaroat, Kevin M.

Fishing, trapping, and vermin destroying

437 7, 437211, 437212, 437215, 437216, H01L 2160

Patent

active

055959393

ABSTRACT:
A liquid-sealed type semiconductor pressure sensor with no filling orifice includes a connector housing which is made of high polymer compound material of high air permeability and which has a recess and connector pins, where a main housing which has a sealing diaphragm is secured to the connector housing airtightly and a pressure sensitive element is disposed in the recess and is electrically connected to external circuitry by connector pins. A pressure detecting chamber formed between the recess and the sealing diaphragm is filled with pressure transmitting medium, such as silicone oil, having high air solubility. To manufacture the sensor, the recess is filled with a fixed volume of the pressure transmitting medium, the main housing is placed on the connector housing, and a prescribed pressure is applied to the sensor to dissolve air trapped in the pressure detecting chamber during the previous step into the transmitting medium and to purge the rest through the high polymer compound materials used in the connector housing. As a result, a non-linear pressure rise in the pressure detecting chamber can be prevented.

REFERENCES:
patent: 4470856 (1984-09-01), Little et al.
patent: 4472239 (1984-09-01), Johnson et al.
patent: 4633573 (1987-01-01), Scherer
patent: 4770050 (1988-09-01), H afner
patent: 4843454 (1989-06-01), Kato et al.
patent: 4876893 (1989-10-01), Kato et al.
patent: 4928376 (1990-05-01), Poglitsch
patent: 5000047 (1991-03-01), Kato et al.
patent: 5386730 (1995-02-01), Ikeda et al.
patent: 5436202 (1995-07-01), Miura

Affiliated with

Also associated with

Rating

Liquid-sealed semiconductor pressure sensor and manufacturing me does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid-sealed semiconductor pressure sensor and manufacturing me, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid-sealed semiconductor pressure sensor and manufacturing me will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2324004