Liquid sealed semiconductor device and method of assembling the

Details Liquid sealed semiconductor device and method of assembling the Liquid sealed semiconductor device and method of assembling the

1991-06-18

1993-02-16

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With desiccant, getter, or gas filling

257787, H01L 2334, H01L 2302

Patent

active

051875659

ABSTRACT:
A liquid sealed semiconductor device comprises a base, semiconductor elements which are mounted to the base, a leading pin passing through the base and protruding to the outside of a package, a cap which is jointed to the base and covers the semiconductor elements, liquid filling the package, a sponge provided within the package and an internal cap for fastening the sponge to the inner wall of the package.
The sponge absorbs the pressure change due to the expansion or the contraction of the internal liquid so as to prevent the liquid from leaking out of the package and to protect the package from being deformed. Furthermore, the internal cap eliminates the possibility that the sponge would drop down.

REFERENCES:
patent: 4730665 (1988-03-01), Cutchaur
patent: 4731644 (1988-03-01), Neidig
patent: 4922381 (1990-05-01), Longerich et al.
Electronic Design--Sep. 22, 1988; Tiny Accelerometer IC Reaches High Sensitivity; Richard Nass.

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