Spring devices – Resilient shock or vibration absorber – Including energy absorbing means or feature
Reexamination Certificate
2007-03-20
2007-03-20
Williams, Thomas (Department: 3683)
Spring devices
Resilient shock or vibration absorber
Including energy absorbing means or feature
C267S219000, C267S141200
Reexamination Certificate
active
10819121
ABSTRACT:
A main liquid chamber and a secondary liquid chamber are formed on both sides of an engine side mounting member to interpose the engine side mounting member. A rubber is vulcanized and molded integrally with the engine side mounting member. A car body side mounting member is injection molded of resin material in a state where the rubber, a pipe for molding a communication hole and the caulk fittings for caulking and fixing a lid member for closing an opening portion leading to one of the main liquid chamber and the secondary liquid chamber and provided in the car body side mounting member are disposed within an injection mold.
REFERENCES:
patent: 1947906 (1934-02-01), Fine
patent: 4690389 (1987-09-01), West
patent: 4985979 (1991-01-01), Speakman
patent: 5076550 (1991-12-01), Mayama et al.
patent: 5120175 (1992-06-01), Arbegast et al.
patent: 5221077 (1993-06-01), Noguchi
patent: 5890704 (1999-04-01), Tsutsumida
patent: 6450486 (2002-09-01), Satori et al.
patent: 6637995 (2003-10-01), White
patent: 0 896 168 (1999-02-01), None
patent: 61-189339 (1986-08-01), None
patent: 03048035 (1991-03-01), None
patent: 07-158687 (1995-06-01), None
patent: 08135719 (1996-05-01), None
patent: 08-152043 (1996-06-01), None
patent: 08152043 (1996-06-01), None
patent: 09-079310 (1997-03-01), None
Arent & Fox PLLC
Honda Motor Co. Ltd.
Williams Thomas
LandOfFree
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