Heat exchange – Conduit within – or conforming to – panel or wall structure – Opposed plates or shells
Patent
1989-05-30
1990-11-20
Schwadron, Martin P.
Heat exchange
Conduit within, or conforming to, panel or wall structure
Opposed plates or shells
165 804, 165185, 361385, F28F 312
Patent
active
049711440
ABSTRACT:
A flexible liquid ribbon cooler for use with electronic components which includes a plurality of elongate thermo-conductive members, which are circular in cross-section, and which are positioned side by side. A bottom and a top layer of thermo-conductive material enclose the bottom and tops of the elongate members and form a plurality of liquid coolant passageways between the elongate members within the layers. The elongate members may be solid cylinders or tubes. A plurality of microcapillaries may be formed in the bottom layer to provide additional thermocoupling, adhesion, and detachability.
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patent: 3428141 (1969-02-01), Forstner et al.
patent: 3739843 (1973-06-01), Haberski
patent: 4008708 (1977-02-01), Hagarty
patent: 4213498 (1980-07-01), Vandenbossche
patent: 4777560 (1988-10-01), Herrell et al.
IBM Tech. Disclosure Bulletin, vol. 22, No. 8A, Jan. 1980, Thermally Enhanced Cold Plate, Nutter et al.
Gibson David A.
Hargis Billy M.
MacKay Colin A.
Smith Robert T.
Weigler Bill
Flanigan Allen J.
Microelectronics and Computer Technology Corporation
Schwadron Martin P.
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