Liquid processing apparatus and liquid processing method

Details Liquid processing apparatus and liquid processing method Liquid processing apparatus and liquid processing method

2007-07-20

2011-11-08

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

C134S137000, C134S157000

Reexamination Certificate

active

08051862

ABSTRACT:
A liquid treatment device having a rotatable substrate holding section (2) for horizontally holding a wafer (W), an annular-shaped rotation cup (4) which surrounds the wafer (W) which rotates with the wafer (W), a rotation mechanism (3) for integrally rotating the rotation cup (4) and the substrate holding section (2), a nozzle (5) for supplying a treatment liquid for the wafer (W) at a treatment position and a cleaning liquid for the rotation cup (4) at its external surface, a liquid supply section (85) for the nozzle (5), and a nozzle movement mechanism for moving the nozzle (5) between the wafer treatment position and the external portion of the rotation cup (4).

REFERENCES:
patent: 2004/0226582 (2004-11-01), Satoshi et al.
patent: 2008/0173333 (2008-07-01), Nanba et al.
patent: 2010/0212701 (2010-08-01), Nanba et al.
patent: 8-1064 (1996-01-01), None
patent: 9-232276 (1997-09-01), None
patent: 2002-170804 (2002-06-01), None
patent: 2004-281641 (2004-10-01), None
patent: 2005-259950 (2005-09-01), None
patent: 2005-286221 (2005-10-01), None
JPO machine translation of Chinju (JP 2004281641), retrieved Jan. 25, 2011.
JPO machine translation of Kiyose (JP 20021708041), retrieved Jan. 25, 2011.
Japanese Office Action mailed on Apr. 20, 2010 for Japanese Application No. 2008-504564 w/ English translation.

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