Etching a substrate: processes – Nongaseous phase etching of substrate
Reexamination Certificate
2008-05-27
2008-05-27
Culbert, Roberts (Department: 1792)
Etching a substrate: processes
Nongaseous phase etching of substrate
Reexamination Certificate
active
07378031
ABSTRACT:
A liquid phase etching method which comprises spraying a chemically reactive liquid, with a specific speed, to a solid article, an aggregate of solid articles or a gelatinous material to be treated; and a liquid etching apparatus having a mechanism for holding a processing object to be treated and a nozzle structure for spraying a chemically reactive liquid to the processing object to be treated which is held by the mechanism. The method and apparatus allow the significant improvement of the etching rate while maintaining the accuracy of etching.
REFERENCES:
patent: 4973379 (1990-11-01), Brock et al.
patent: 5041229 (1991-08-01), Brock et al.
patent: 1124406 (1996-06-01), None
patent: 4-131388 (1992-05-01), None
patent: 5-251421 (1993-09-01), None
patent: 9-27654 (1997-01-01), None
patent: 2001-15477 (2001-01-01), None
patent: 2002-16031 (2002-01-01), None
Y. L. Chen, et al., Aerosol Jet Etching, Aerosol Science and Technology, 1990, vol. 12, pp. 842 to 855.
International Search Report (Japanese and English language versions) for PCT/JP2004/002073, dated Jun. 1, 2004.
Kanada Hisataka
Mizuno Bunji
Nakayama Ichiro
Sasaki Yuichiro
Culbert Roberts
Matsushita Electric - Industrial Co., Ltd.
RatnerPrestia
LandOfFree
Liquid phase etching method and liquid phase etching apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Liquid phase etching method and liquid phase etching apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid phase etching method and liquid phase etching apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2796942