Liquid phase diffusion bonding using high diffusivity element as

Details Liquid phase diffusion bonding using high diffusivity element as Liquid phase diffusion bonding using high diffusivity element as

1991-05-03

1993-06-22

Seidel, Richard K.

Metal fusion bonding

Process

Diffusion type

228194, 22826313, B23K 2800, B23K10300

Patent

active

052210391

ABSTRACT:
A liquid phase diffusion bonding method using an insert material such as B,C,Si and Hf having a high diffusivity and a melting point higher than that of the base metal is disclosed. During the bonding, the insert material is not melted, but the insert material and the base metal are reacted with each other in such a manner that the diffusion bonding can be carried out under a non-oxidizing atmosphere at a temperature lower than the melting point of the insert material.

REFERENCES:
patent: 3088192 (1963-05-01), Turner
patent: 3530568 (1970-09-01), Owczarski
patent: 3708866 (1973-01-01), Wells
patent: 4691856 (1987-09-01), Haramaki et al.

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