Liquid metal thermal interface material system

Details Liquid metal thermal interface material system Liquid metal thermal interface material system

2008-02-08

2010-02-16

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S720000, C257SE23109

Reexamination Certificate

active

07663227

ABSTRACT:
A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic component, and design features to promote long-term reliability and high thermal performance.

REFERENCES:
patent: 6617682 (2003-09-01), Ma et al.
patent: 6665186 (2003-12-01), Calmidi et al.
patent: 6794223 (2004-09-01), Ma et al.
patent: 7019971 (2006-03-01), Houle et al.
patent: 7220624 (2007-05-01), Neogi et al.
patent: 7510108 (2009-03-01), Lawlyes et al.
patent: 2001/0013424 (2001-08-01), Takase et al.

Affiliated with

Also associated with

Rating

Liquid metal thermal interface material system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid metal thermal interface material system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid metal thermal interface material system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4170608