Liquid metal thermal interface material system

Details Liquid metal thermal interface material system Liquid metal thermal interface material system

2005-10-11

2009-06-30

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257SE23101, C257SE23102, C257SE23109

Reexamination Certificate

active

07554190

ABSTRACT:
A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic component, and design features to promote long-term reliability and high thermal performance.

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