Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2008-03-25
2008-03-25
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257S712000, C257SE23097, C257SE23098
Reexamination Certificate
active
10917702
ABSTRACT:
A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal. Other embodiments are described and claimed.
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Chrysler Gregory M.
Sauciuc Ioan
Intel Corporation
Mandala Jr. Victor A.
Nelson Kenneth A.
Pert Evan
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