Liquid metal thermal interface for an integrated circuit device

Details Liquid metal thermal interface for an integrated circuit device Liquid metal thermal interface for an integrated circuit device

2008-03-25

2008-03-25

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S706000, C257S712000, C257SE23097, C257SE23098

Reexamination Certificate

active

07348665

ABSTRACT:
A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal. Other embodiments are described and claimed.

REFERENCES:
patent: 3654528 (1972-04-01), Barkan
patent: 4037246 (1977-07-01), Pellant et al.
patent: 5658831 (1997-08-01), Layton et al.
patent: 6658861 (2003-12-01), Ghoshal et al.
patent: 6708501 (2004-03-01), Ghoshal et al.
patent: 6791839 (2004-09-01), Bhagwagar
patent: 6795315 (2004-09-01), Wu et al.
patent: 6815835 (2004-11-01), James
patent: 7030485 (2006-04-01), Houle et al.
patent: 914034 (1962-12-01), None
patent: 60084848 (1985-05-01), None
U.P. Hwang et al., “Electronic Equipment Cooling Using MHD Flow of Coolant”,IBM Technical Disclosure Bulletin, vol. 12, No. 3, Aug. 1969, p. 386-387, IBM Corporation, New York, USA.
PCT International Search Report and Written Opinion, mailed Dec. 9, 2005, PCT Application No. PCT/US2005/025815.

Affiliated with

Also associated with

Rating

Liquid metal thermal interface for an integrated circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid metal thermal interface for an integrated circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid metal thermal interface for an integrated circuit device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2801141