Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1991-11-14
1992-12-15
Seidel, Richard K.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228248, 228208, 2281802, 439178, 257724, B23K 3102
Patent
active
051709309
ABSTRACT:
A thermally and electrically conductive paste for making a detachable and compliant connection between two surfaces. The paste comprises an equilibrium mixture of an electrically conductive liquid metal and particulate solid constituents, wherein at the temperature of the paste during connection the proportions of liquid metal and particulate solid constituents remain between the ultimate liquidus and the ultimate solidus of the phase diagram of the mixture and the paste remains non-solidified. in cryogenic and low temperature environments the paste forms a hardened bond with a TCE matched to a contacted surface.
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Dolbear Thomas P.
MacKay Colin A.
Nelson Richard D.
Mah Chuck Y.
Microelectronics and Computer Technology Corporation
Seidel Richard K.
Sigmond David M.
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