Liquid lamination process

Details Liquid lamination process Liquid lamination process

1976-11-29

1978-01-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

96 36, 96 83, 156236, 156247, 156307, 156659, B32B 3102

Patent

active

040690768

ABSTRACT:
The process of this invention applies a photoresist film to a preimaged patterned relief substrate wherein the height of the relief image is at least 0.00004 inch (0.001 mm) and the thickness of the photoresist film is at least one third the thickness of the relief image height. Prior to the application of the photoresist film, the patterned relief substrate is flooded with a swelling agent for the photoresist, the depth of flooding being at least to cover the relief height. The process can occur at room temperature.

REFERENCES:
patent: 3402087 (1968-09-01), Yackel et al.
patent: 3617411 (1971-11-01), Couture et al.
patent: 3629036 (1971-12-01), Isaacson
patent: 3976524 (1976-08-01), Feng

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