Liquid jet recording substrate, the method of manufacture theref

Incremental printing of symbolic information – Ink jet – Ejector mechanism

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B41J 205

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active

055963579

ABSTRACT:
A substrate for liquid jet recording head comprises a supporting member with an oxidized film on its surface, exothermic resistive members arranged on the supporting member, and wirings electrically connected to the exothermic resistive members. For the substrate, it is arranged that the transposition density in the area beneath the oxidized film on said supporting member is less than 5.times.10.sup.4 ; hence eliminating the curves of the substrate which will be created when it is cut for the fabrication of a liquid jet recording head.

REFERENCES:
patent: 4313124 (1982-01-01), Hara
patent: 4345262 (1982-08-01), Shirato et al.
patent: 4459600 (1984-07-01), Sato et al.
patent: 4463359 (1984-07-01), Ayata et al.
patent: 4558333 (1985-12-01), Sugitani et al.
patent: 4608577 (1986-08-01), Hori
patent: 4723129 (1988-02-01), Endo et al.
patent: 4725849 (1988-02-01), Koike et al.
patent: 4740796 (1988-04-01), Endo et al.
patent: 4809428 (1989-03-01), Aden et al.
patent: 5469200 (1995-11-01), Terai
Wolf. S., et al. "Silicon Processing For The VLSI Era, vol. 1: Process Technology", Lattice Press (1986) pp. 40-56 & 532-534.

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