Liquid jet recording head manufacturing method by anisotropic et

Details Liquid jet recording head manufacturing method by anisotropic et Liquid jet recording head manufacturing method by anisotropic et

1996-08-06

1999-05-11

Burr, Edgar

Etching a substrate: processes

Forming or treating thermal ink jet article

347 65, 298901, B41J2/05

Patent

active

059024925

ABSTRACT:
A liquid jet recording head comprising discharge energy generating means for generating discharge energy in the recording liquid, and a liquid flow passage forming substrate for forming liquid flow passages through which the recording liquid is flowed toward the discharge ports, characterized in that the surface of said liquid flow passage forming substrate and the lateral faces of said liquid flow passages are constituted of a plane of single crystalline silicone and a pair of planes perpendicular thereto, respectively.

REFERENCES:
patent: 4216477 (1980-08-01), Matsuda et al.
patent: 4313124 (1982-01-01), Hara
patent: 4345262 (1982-08-01), Shirato et al.
patent: 4417251 (1983-11-01), Sugitani
patent: 4459600 (1984-07-01), Sato et al.
patent: 4463359 (1984-07-01), Ayata et al.
patent: 4558333 (1985-12-01), Sugitani et al.
patent: 4723129 (1988-02-01), Endo et al.
patent: 4740796 (1988-04-01), Endo et al.
patent: 4970532 (1990-11-01), Komuro et al.
patent: 5068006 (1991-11-01), Fisher
patent: 5148595 (1992-09-01), Doggett et al.
patent: 5332466 (1994-07-01), Nozawa
patent: 5443687 (1995-08-01), Koyama et al.
patent: 5508725 (1996-04-01), Goto et al.
patent: 5530465 (1996-06-01), Hasegawa et al.

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