Liquid jet recording head fabrication method

Etching a substrate: processes – Adhesive or autogenous bonding of two or more... – Removing at least one of the self-sustaining preforms or a...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

216 99, 216 48, 3461401, B44C 122, C23F 102

Patent

active

054395542

ABSTRACT:
There is disclosed a method for fabricating a liquid jet recording head having heat acting portions, communicating to orifices for liquid discharge, for applying heat energy to a liquid to form a bubble therein, electricity-heat converters for generating said heat energy, pairs of electrodes, and an upper protective layer, characterized in that the wet etching rate of electrode layer is higher on the upper portion in a direction of film thickness than on the lower portion.

REFERENCES:
patent: 4313124 (1982-01-01), Hara
patent: 4345262 (1982-08-01), Shirato et al.
patent: 4459600 (1982-07-01), Sato et al.
patent: 4463359 (1984-07-01), Ayata et al.
patent: 4558333 (1985-12-01), Sugitani et al.
patent: 4608577 (1986-08-01), Hori
patent: 4723129 (1988-02-01), Endo et al.
patent: 4740796 (1988-04-01), Endo et al.
patent: 5211806 (1993-05-01), Wong et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Liquid jet recording head fabrication method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid jet recording head fabrication method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid jet recording head fabrication method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-968921

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.