Liquid interface diffusion method of bonding titanium and/or tit

Details Liquid interface diffusion method of bonding titanium and/or tit Liquid interface diffusion method of bonding titanium and/or tit

1975-06-13

1976-05-18

Shore, Ronald J.

Metal fusion bonding

Process

Diffusion type

228181, 228195, 228200, 228221, 228239, 228263, B23K 3102

Patent

active

039571947

ABSTRACT:
A liquid interface diffusion process for bonding titanium or titanium alloys wherein at least one of the titanium type materials to be fayed is sequentially plated with a total weight of from between 1 and 5 gms/ft.sup.2 of honeycomb core of layers of copper and nickel or an alloy made therefrom. The faying surfaces are then held together to maintain position on alignment, placed in a protective atmosphere, the temperature of the materials are then raised at a controlled rate causing sufficient solid state diffusion to occur and a liquid to form continuing to increase the temperature to a predetermined level and holding at this temperature until a solidification occurs and sufficient additional solid state diffusion occurs producing a desirable dilution of bridge material and titanium at the joint, and then reducing the temperature at a controlled rate to a lower temperature to complete the bonding cycle.

REFERENCES:
patent: 2906008 (1959-09-01), Boegehold et al.
patent: 3365787 (1968-01-01), Forsberg et al.
patent: 3417461 (1968-12-01), Wells et al.
patent: 3466737 (1969-09-01), Hanink
patent: 3561099 (1971-02-01), Mizuhara
patent: 3768985 (1973-10-01), Woodward
patent: 3769101 (1973-10-01), Woodward
patent: 3854194 (1974-12-01), Woodward

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