Liquid immersion cooling apparatus for electronic systems operat

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

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16510419, 16510426, 165 803, 165 804, 361699, 361689, 361677, F28D 1500

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active

060191678

ABSTRACT:
The invention relates to a passive liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments. The apparatus comprises an external shell, defining a chamber with a plurality of heat dissipating components disposed within the chamber and surrounded by the shell. The components are immersed into a low boiling point dielectric liquid partially filling the chamber. The shell has two portions, an upper portion of the shell adjacent the area above the liquid level which forms a vapor space, and a lower portion of the shell adjacent the liquid. The shell has an external heat transfer structure providing more efficient heat transfer from the upper part of the shell, for example, in the form of external fins extending outward from the shell, and an internal heat transfer structure in the form of internal fins extending inward from the shell and into the chamber. Preferably, the external fins extend along the upper portion of the shell only. The external heat transfer structure provides effective thermal management of the electronic components within the apparatus over a wide outdoor temperature range. Additionally, a cylindrical design of the apparatus provides more reliable sealing and better pressure containment of the apparatus and may include a solar shield. An assembly of cooling apparatus employing the liquid immersion cooling apparatus and additionally comprising a conduction cooling apparatus, a forced convection cooling apparatus, and a solar shield is also disclosed.

REFERENCES:
patent: 1550154 (1925-08-01), Faccioli
patent: 1780110 (1930-10-01), Bliss
patent: 3489207 (1970-01-01), Miller
patent: 3741292 (1973-06-01), Kumar et al.
patent: 4619316 (1986-10-01), Nakayama et al.
patent: 4745966 (1988-05-01), Avery
patent: 4790370 (1988-12-01), Niggemann
patent: 5411077 (1995-05-01), Tousignant
patent: 5529115 (1996-06-01), Paterson
patent: 5842514 (1998-12-01), Zapach et al.
"Chips Immersion Cooled Inside Device Package", Howard W. Markstein, Electronic Packaging and Production, Jan. 1993, p. 33.

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