Liquid film interface cooling system for semiconductor wafer pro

Details Liquid film interface cooling system for semiconductor wafer pro Liquid film interface cooling system for semiconductor wafer pro

1991-04-25

1992-02-11

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361380, 361382, 357 82, H05K 720

Patent

active

050880063

ABSTRACT:
A semiconductor wafer, liquid interface clamping and cooling system 80 includes a chuck 10 having clamping section 12 with a top surface 16 with three clamping/cooling circuit grooves machined therein for providing a liquid interface between a wafer under test and the top surface 16. A bottom surface 64 of the clamping section has a double spiral cooling circuit machined therein for providing backside cooling. A source vessel 110 maintained at atmospheric pressure provides fluid to the top surface clamping/cooling circuits and a collection vessel 112 maintained at house vacuum pressure collects the fluid. A set of processor controlled valves 114, 118, 128, 130, 132, 141, 142 144, 158 and 164 control the fluid in a preprogrammed sequence. A chiller system 82 and pump 90 provide temperature regulated fluid flow to the clamping section 12 bottom surface 64.

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IBM Technical Disclosure Bulletin, Antonetti et al., "Liquid Cooling Distribution Circuit With Bypass Reservoir", vol. 23, No. 3, 1/81, pp. 3806-3807.

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