Liquid film interface cooling chuck for semiconductor wafer proc

Details Liquid film interface cooling chuck for semiconductor wafer proc Liquid film interface cooling chuck for semiconductor wafer proc

1991-04-25

1993-02-16

Flanigan, Allen J.

Heat exchange

With retainer for removable article

Electrical component

324158F, F28F 700

Patent

active

051862387

ABSTRACT:
A liquid interface cooling chuck assembly 10 includes a clamping section 12 having a top surface 16 with three separate cooling circuit grooves machined therein and a bottom surface 64 having a double spiral cooling circuit machined therein. The clamping section 12 is soldered to the flat top surface 18 of the support section 14 which as a bottom surface having structural ribs machined therein. Liquid is provided to the three cooling circuits of clamping section 12 to provide a liquid interface between a wafer and the top surface 16 of the clamping section 12. A cooling fluid is also circulated through the bottom surface cooling circuit.

REFERENCES:
patent: 4010489 (1977-03-01), Bourbeau et al.
patent: 4508161 (1985-04-01), Holden
patent: 4603466 (1986-08-01), Morley
patent: 4614227 (1986-09-01), Vogel
patent: 4628991 (1986-12-01), Hsiao et al.
patent: 4750086 (1988-06-01), Mittal
patent: 4757255 (1988-07-01), Margozzi
patent: 4897762 (1990-01-01), Daikoku
patent: 4918928 (1990-04-01), Morioka
patent: 4920574 (1990-04-01), Yammamoto
patent: 4942497 (1990-07-01), Mine
patent: 4967832 (1990-11-01), Porter
patent: 4969168 (1990-11-01), Sakamoto
patent: 5033538 (1991-07-01), Wagner et al.
patent: 5034688 (1991-07-01), Moulene et al.

Affiliated with

Also associated with

Rating

Liquid film interface cooling chuck for semiconductor wafer proc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid film interface cooling chuck for semiconductor wafer proc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid film interface cooling chuck for semiconductor wafer proc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2142064