Liquid filled hot plate for precise temperature control

Details Liquid filled hot plate for precise temperature control Liquid filled hot plate for precise temperature control

1992-10-22

1994-01-04

Ford, John K.

Heat exchange

With retainer for removable article

Including liquid heat exchange medium

165 801, 165168, 165 804, 156345, F28F 312, F28F 700, C23F 102

Patent

active

052752372

ABSTRACT:
A liquid filled hot plate used in integrated circuit fabrication baking processes. The hot plate uses heated liquid which is pumped throughout a circulatory system, for heating the hot plate. The hot plate has a cavity which has symmetrical parallel partitions dividing the cavity into equal halves, where the inlet fluid line determines the left and right halves. Therefore, temperature control of the hot plate can be achieved to +/-0.25 degrees C., and temperature spiking phenomenon can be depreciated.

REFERENCES:
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patent: 5034688 (1991-07-01), Moulene et al.
patent: 5070936 (1991-12-01), Carroll et al.
Cohen et al., Heat Transfer in a Liquid Cooling System, IBM Technical Disclosure vol. 11, No. 6, Nov. 1968.

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